Rework and Repair of Double Layer, Multilayer Printed Circuit Boards and Flexible

This Training of 4 days is designed for Technicians with experience

One more day is recommended for less experienced employees.

Content :

• The Logical Approach to Repair Training
• Analysis and Definition of the Problem
• Defined the Procedures of Work
• Base Material of Substrate and Coatings
• Removing Conformal Coating
• Different Methods of Component Removal
• Different Methods of Component Removal on Large Thermal Mass Using Auxiliary Heat
• Wire Repair Method
• Flat Conductor Repair Method with Cir-Kit Conductors
• Repair of Lifted or Missing Pads
• Removal and Replacement of Eyelets, Rivets and Terminals
• Repairing a Burned or Missing Section of Circuit Board
• Repairing Multilayer Boards and Flex
• Refurbishing/Replating Repair or Worn Edge Connectors
• Modifications & Repair with Jumper wires
• Evaluation by the Standards IPC 7711/7721

At the end of the Training the student’s will received: 

• A training Handbook
• The Circuits that they assembled during the training
• A Certificate of our Company

The Training will be provided by highly skilled IPC Certified instructors

(A-610, ANSI-J-STD-001, IPC 7711/7721)

Hand tools solder station and microscope for each workbench

Circuits, Components and a Handbook are provided.

To download our courses